- All sections
- C - Chemistry; metallurgy
- C09J - Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives
- C09J 7/00 - Adhesives in the form of films or foils
Patent holdings for IPC class C09J 7/00
Total number of patents in this class: 1955
10-year publication summary
|
242
|
219
|
220
|
205
|
151
|
65
|
43
|
61
|
35
|
11
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Nitto Denko Corporation | 7879 |
193 |
| 3m Innovative Properties Company | 18406 |
125 |
| Lintec Corporation | 1915 |
120 |
| Dexerials Corporation | 1826 |
96 |
| LG Chem, Ltd. | 17205 |
91 |
| Hitachi Chemical Company, Ltd. | 2455 |
86 |
| Tesa SE | 1011 |
62 |
| Zeon Corporation | 3854 |
33 |
| Samsung SDI Co., Ltd. | 6671 |
31 |
| Mitsubishi Chemical Corporation | 4313 |
27 |
| FUJIFILM Corporation | 27102 |
25 |
| DIC Corporation | 3597 |
25 |
| Avery Dennison Corporation | 1291 |
20 |
| Samsung Electronics Co., Ltd. | 131630 |
19 |
| Soken Chemical & Engineering Co., Ltd. | 249 |
19 |
| Tesa AG | 82 |
19 |
| The Furukawa Electric Co., Ltd. | 3486 |
18 |
| Sony Chemical & Information Device Corporation | 268 |
18 |
| Toray Industries, Inc. | 6652 |
17 |
| Mitsubishi Plastics, Inc. | 347 |
16 |
| Other owners | 895 |